A new patent from Bambu Lab's parent company describes a monolithic heatbed with an embedded heating element aimed at more even heating and better adhesion.
Bambu Lab's parent company, Shenzhen Tuozhu Technology, has filed a U.S. patent application for a redesigned heatbed, published September 10, 2026. The design aims to heat the print bed more evenly, addressing the warping and peeling issues common with large 3D prints. The patent's abstract says the construction improves adhesion and print quality, though specific performance claims are not yet backed by testing.
The patent describes replacing the typical laminated heating sheet with a
Analyst predicts a shakeout as the crowded quantum-computing market struggles to turn a profit, despite early enterprise adoption.
A high-severity Nvidia bug in DCGM Exporter could let unauthenticated attackers crash GPU monitoring on internet-exposed servers, disrupting AI workloads.
Researchers argue that software-level efficiency gains, not just new hardware, can meaningfully cut AI energy use.
The bilateral agreement promises information-sharing and coordinated disruption, though operational details remain thin.