Frore Systems has unveiled LiquidJet Diamond, a bespoke liquid-cooling coldplate that pairs a diamond heat spreader with a 3D short-loop jet-channel microstructure. The company says the design targets next-generation AI accelerators such as Nvidia's Rubin and AMD's Instinct MI400 and MI500 series, where hotspot power densities are climbing well beyond what conventional copper coldplates can handle.
According to Frore, the diamond wafers sit directly above a GPU's hotspots, spreading heat before it reaches the liquid channels. Diamond's thermal conductivity can exceed 20 W/cm·K, versus roughly 4 W/cm·K for copper. That allows the coldplate to handle hotspots up to 770 W/cm², compared with about 600 W/cm² for Frore's earlier LiquidJet. The company claims complete LiquidJet Diamond assemblies reduce GPU temperatures by 16–22C versus conventional coldplates and improve AI token throughput per watt by 30–35%.
Frore plans to demonstrate LiquidJet Diamond at the OCP Global Summit in October, showcasing cooling for Nvidia's 2,300W Rubin accelerator. The company has not disclosed how the diamond wafers are manufactured or integrated, nor whether the demo uses production GPUs or a thermal test vehicle. The claims are based on Frore's models and simulations rather than independent testing.