GlobalFoundries and TSMC have signed a five-year, $2 billion agreement under which GlobalFoundries will produce silicon interposers for TSMC's CoWoS advanced packaging at its Malta, New York fab. Volume production is scheduled to ramp in the first half of 2028. These interposers provide high-density connections between logic chiplets and high-bandwidth memory stacks in AI and high-performance computing processors.
Both Tom's Hardware and The Register report the same core facts: the deal's value, term, and location. They also agree the move helps close a US packaging gap. The Register notes that TSMC's Arizona-made Blackwell GPUs previously had to be sent to Taiwan for final assembly, while Tom's Hardware ties the agreement to TSMC's plans to bring CoWoS packaging to Arizona by 2029.
The two outlets differ in emphasis. Tom's Hardware highlights technical and business uncertainties: interposers are application-specific, GlobalFoundries will act as a subcontractor rather than a standard supplier, and the deal does not cover bonding, substrate assembly, or testing. The Register instead points to Intel Foundry as an existing US alternative with CoWoS-like packaging, suggesting customers are not wholly dependent on TSMC's timeline.