In its October 17 premium roundup, Tom's Hardware maps out Intel's advanced packaging roadmaps for EMIB and Foveros. The company's stated goal is to build system-in-packages as large as 12 reticles by combining both approaches, and the report notes that new customers are looking for more sophisticated packaging options as Intel matures these technologies.
ASML also posted a record quarter, reporting $13 billion in revenue and saying demand for its lithography machines continues to outstrip supply. The company is expanding capacity, with customers eager to secure orders in 2030 as expected demand exceeds what ASML can supply in 2027 and 2028. In AI hardware, Sipeed revealed the Maixstation, a Chinese-made rival to the DGX Spark and Ryzen AI Halo, pairing Axera's AX8860P with 128GB of LPDDR5X at 273 GB/s and an expected price of $3,999.
SK hynix is reportedly adding a custom core called H-TPU to its SSD controllers to take over repetitive operations, easing the load on Arm cores. The company says each H-TPU draws about 2.5% of a CPU core's power, freeing the main cores for other work as drive speeds continue to climb.