At FMS 2026, ServeTheHome got a close look at BiCS NAND, the flash memory line jointly developed by Kioxia and SanDisk. Kioxia's display included a BiCS FLASH Generation 10 1Tb TLC wafer built with CBA technology and 332 layers, alongside a die cross-section. The cross-section shows that the layers are not perfectly vertical; some are offset, and package balls provide a sense of scale.
SanDisk's booth showed BiCS FLASH Generation 8 under a microscope. The opened package reveals tiny wires running between layers, details normally invisible from outside. A later view showed the cells that store data, giving a sense of what the package contains when sealed.
These show-floor demos highlight the engineering required to pack more capacity and speed into NAND as AI drives demand. ServeTheHome notes that such microscope displays have appeared at shows before, but this is the first time it covered them, and many viewers may not have seen opened NAND packages. The article does not offer a direct comparison between the two generations.