According to a Tom's Hardware report, Elon Musk's Terafab is expected to receive its first extreme ultraviolet (EUV) lithography tool from ASML in mid-2027. The report frames this as a pragmatic first step: even if Musk prefers free-electron laser (FEL) light sources for in-house chip production, the initial tooling will come from the established EUV supplier.
The scanner, however, may not go into immediate production. The report notes the cutting-edge machine could sit idle for some time while the experimental facility is finished. This suggests that Terafab is still in an early build-out phase, with the ASML tool arriving ahead of full operational readiness.
The choice of ASML underscores the gap between experimental FEL concepts and the proven manufacturing infrastructure that still underpins leading-edge chipmaking. The source does not mention timelines for FEL adoption, only that Terafab will start with ASML's technology.