For years, test compression has been the go‑to technique for managing the massive data volumes generated by complex system‑on‑chip (SoC) designs. But as AI and high‑performance computing (HPC) devices push the limits of integration, a new bottleneck is appearing: how to distribute that compressed test data efficiently across the entire chip. Simply shrinking the data footprint is no longer enough if the physical and logical paths to each core or block cannot keep up.
The answer, according to recent analysis, lies in hierarchical connectivity. Instead of treating the SoC as a single flat test target, designers are adopting layered structures that route test data through local hubs and then to individual blocks. This approach reduces the distance and contention that plague flat distribution networks, especially in chips with hundreds of cores or specialized accelerators. It also enables more granular control—testing only the active region while leaving others idle, which is vital for power and thermal limits.
What this means for the industry is a shift in mindset. Compression remains a necessary tool, but it is no longer the whole solution. The next wave of test innovation will focus on the architecture of test delivery itself—how data flows through hierarchical networks, how to balance bandwidth across tiers, and how to keep test time low without sacrificing coverage. For AI and HPC designers, this is not an optional upgrade but a prerequisite for bringing next‑generation silicon to market reliably.