Ex-NCA officer who stole Bitcoin from Silk Road 2.0 case ordered to repay £1.8M
A former National Crime Agency officer who stole 50 Bitcoin from the Silk Road 2.0 investigation must pay back over £1.8 million.
Chips, datacenters, interconnect, and the power they draw.
A former National Crime Agency officer who stole 50 Bitcoin from the Silk Road 2.0 investigation must pay back over £1.8 million.
A rare discount on an officially licensed Switch 2 storage card offers relief amid the ongoing memory shortage.
A custom 810-piece recreation of ASML's exclusive TWINSCAN EXE:5000 Lego kit is now freely available on Rebrickable.
Amazon is expanding its Bee wearable line with two conversation-recording devices that feed summaries into Alexa and shopping recommendations.
A new report warns that fast-growing Asia Pacific midmarket businesses are adopting SaaS and AI tools without matching data protection safeguards.
Public naming contest opens for the UK's £60m spacecraft that will grab and de-orbit two defunct satellites.
Retrofitting the nation's industrial and commercial motors with variable frequency drives could cut their electricity use by roughly half and ease grid strain.
HUMXN's free home-service program in three US cities trades skilled-trade work for wearable-sensor recordings meant to train future AI robots.
Vercel's gateway data shows open-weight models handle most tokens and have quadrupled their share of paid AI usage since June.
Tom's Hardware's weekly roundup points to Intel's 12-reticle packaging goal, ASML's record revenue, a Chinese DGX Spark rival, and SK hynix's SSD controller cores.
Taiwan is aligning its export controls with U.S. trade bans by making AI server smuggling to China a criminal offense punishable by up to five years in prison.
New prototypes aim to automate entanglement requests across heterogeneous quantum systems, moving beyond manual point-to-point setups.
Ryan Dahl's move from Deno to Cloudflare Workers signals a pivot from traditional Node-style servers to lightweight distributed runtimes.
A weekly review of hardware engineering blogs highlights new interconnect and memory standards plus the need for real-world AI testing.
As chips stack vertically, engineers must co-optimize voltage, timing, thermal, and power together—a loop no current tool can close.
A methodology embeds multiphysics simulation directly into chiplet package design to cut redesign cycles and late-stage surprises.
A new design paradigm, electronic photonic design automation, is becoming essential as silicon photonics and bandwidth demands force tighter integration of light and electronics.
Radiation, cryogenic temperatures, and mechanical shock are converging in space and defense systems, forcing chip designers to validate against multiple simultaneous stressors.